| RTV-1, Acetoxy-Cure Silicone Adhesive | Polydimethylsiloxane with acetoxy-functional crosslinking agents | One-part, moisture-cured; releases acetic acid | Skin formation: approximately 5–30 minutes; full cure: approximately 24–72 hours, depending on thickness and humidity | Approximately −50°C to 200°C; specialized grades may reach about 250°C | Approximately 1–3 MPa tensile strength | Approximately 200–500% | General glass bonding, sealing, appliance assembly, low-cost industrial maintenance, and non-sensitive metal or ceramic joints |
| RTV-1, Neutral-Cure Silicone Adhesive | Polydimethylsiloxane with alkoxy-, oxime-, or amine-functional systems | One-part, moisture-cured; low-corrosion or non-corrosive cure options | Skin formation: approximately 10–40 minutes; full cure: approximately 24–96 hours | Approximately −50°C to 180°C; high-temperature grades may reach about 250°C | Approximately 1.5–4 MPa tensile strength | Approximately 150–600% | Electronics housings, coated metals, plastics, mirrors, lighting, transportation components, and construction joints |
| RTV-2, Addition-Cure Silicone Adhesive | Vinyl-terminated silicone polymer with hydride crosslinker and platinum catalyst | Two-part, platinum-catalyzed addition cure; low volatile by-products | Approximately 10 minutes to 24 hours; accelerated grades may cure in minutes with heat | Approximately −60°C to 200°C; some formulations operate near 250°C | Approximately 2–7 MPa tensile strength or 0.5–3 MPa lap-shear strength | Approximately 100–400% | Electronic potting, sensor protection, medical-device assembly, optical components, and precision industrial bonding |
| Heat-Cured Silicone Adhesive | High-consistency or liquid silicone rubber with peroxide or platinum curing systems | One-part or two-part thermal cure | Approximately 5–60 minutes at 100–180°C, depending on grade and component thickness | Approximately −60°C to 250°C; short-term exposure may exceed 300°C for selected grades | Approximately 3–10 MPa tensile strength | Approximately 100–600% | Automotive gaskets, aerospace components, high-temperature seals, molded assemblies, and demanding electrical insulation |
| UV- or Visible-Light-Curable Silicone Adhesive | Light-reactive silicone polymer with photoinitiator package | UV, visible-light, or dual-cure system for shadowed areas | Approximately 5–120 seconds under suitable light intensity; secondary cure may require moisture or heat | Approximately −50°C to 180°C; specialized grades may reach about 200°C | Approximately 1–5 MPa tensile strength or 0.5–3 MPa lap-shear strength | Approximately 50–400% | Optical bonding, medical disposables, miniaturized electronics, display components, and high-throughput assembly lines |
| Silicone Pressure-Sensitive Adhesive | Silicone elastomer or resin blended for permanent tack | Pre-cured or thermally cured coating; bonds through pressure and surface contact | Immediate handling bond; final adhesion may develop over several hours | Approximately −40°C to 200°C; selected products may operate above 200°C | Typically reported as peel adhesion: approximately 1–10 N/25 mm, depending on substrate and test method | Usually high flexibility; often greater than 100% | High-temperature tapes, labels, medical electrodes, release liners, insulation systems, and flexible electronics |
| Thermally Conductive Silicone Adhesive | Silicone matrix filled with ceramic materials such as alumina, aluminum nitride, or boron nitride | Moisture, addition, or heat cure, depending on formulation | Approximately 1–72 hours at room temperature; heat-accelerated versions cure faster | Approximately −50°C to 180°C; some grades are rated near 250°C | Approximately 0.5–5 MPa lap-shear strength | Approximately 20–200% | LED modules, power electronics, battery systems, heat sinks, sensors, and thermal interface assemblies |
| Electrically Insulating Silicone Adhesive | Silicone elastomer with electrically non-conductive fillers or additive packages | RTV-1, RTV-2, UV, or heat cure | Approximately 10 minutes to 72 hours, depending on cure technology | Approximately −60°C to 200°C; selected grades may reach 250°C | Approximately 1–6 MPa tensile strength or 0.5–4 MPa lap-shear strength | Approximately 50–500% | Wire and cable protection, coil insulation, transformers, circuit-board protection, connectors, and electrical enclosures |
| Low-Volatility or Low-Outgassing Silicone Adhesive | Purified silicone polymers with controlled low-molecular-weight content | Usually addition-cure, heat-cure, or specially formulated neutral cure | Approximately 1 hour to 7 days, depending on temperature and product design | Approximately −60°C to 200°C; aerospace grades may be qualified for wider ranges | Approximately 1–6 MPa tensile strength or 0.5–4 MPa lap-shear strength | Approximately 50–400% | Space hardware, optical instruments, vacuum equipment, sensors, camera modules, and contamination-sensitive electronics |
| Medical- and Skin-Contact Silicone Adhesive | High-purity silicone elastomer designed for biocompatibility and gentle adhesion | Platinum addition cure or controlled pressure-sensitive adhesive technology | Instant adhesion for pressure-sensitive grades; approximately 1–48 hours for curable systems | Often approximately −40°C to 150°C; qualification depends on the finished device | Formulation-specific; commonly optimized for controlled peel and low-trauma removal rather than maximum structural strength | Often approximately 100–700% | Wound dressings, medical tapes, wearable sensors, tubing, ostomy products, prosthetic interfaces, and medical-device assembly |