| 1 | Frame and hinges | Injection-molded engineering plastics, such as polyamide or polycarbonate; metal hinge parts | Frame parts are molded or machined, finished, and assembled with hinges and fasteners. | Dimensional fit, hinge movement, surface finish, and frame strength |
| 2 | Lenses and optical elements | Prescription or non-prescription lens materials; optional waveguide or other display optics in display-equipped models | Lenses are cut, edged, coated when required, and fitted into the frame; optical display parts need precise alignment. | Lens fit, optical clarity, coating appearance, and display alignment where applicable |
| 3 | Camera module | Image sensor, compact lens assembly, and camera support circuitry | Camera modules are assembled and positioned in the frame, then connected to the main board. | Focus, image capture, field of view, and camera-to-software operation |
| 4 | Microphones and audio system | MEMS microphones, miniature speakers, acoustic ports, and audio circuitry | Microphones and speakers are installed in designated frame cavities and connected to the audio electronics. | Microphone input, speaker output, channel balance, and acoustic-port blockage |
| 5 | Processor and memory | Low-power application processor, memory, and supporting electronic components | Components are mounted on a printed circuit board using surface-mount assembly and then integrated into the frame. | Board inspection, boot testing, connectivity, and thermal behavior |
| 6 | Wireless connectivity | Bluetooth and, on some designs, Wi-Fi; antennas integrated into or positioned within the frame | Radio components and antennas are assembled with the electronics, with placement tuned to the product design. | Pairing, connection stability, antenna performance, and regulatory testing requirements |
| 7 | Battery and power management | Rechargeable lithium-based cells, charging circuitry, and power-management components | Cells are secured in available frame space and connected to the power-management system. | Charging behavior, protection-circuit operation, capacity, and temperature during testing |
| 8 | Controls and sensors | Touch controls or buttons; optional inertial, proximity, or wear-detection sensors | Controls and sensors are mounted in the frame or on the circuit board and calibrated through software. | Control response, sensor readings, calibration, and wearing-state detection where supported |
| 9 | Firmware and AI software | Embedded firmware, companion-device software, and AI functions processed locally or through connected services | Firmware is loaded during production; software features are checked with compatible test devices and network conditions. | Startup, update process, feature response, privacy controls, and app connectivity |
| 10 | Final assembly and product testing | Integrated frame, optics, electronics, battery, and finished packaging | Subassemblies are fitted together, inspected, function-tested, cleaned, and packed for shipment. | Appearance, fit, audio and camera functions, charging, wireless connection, and packaging completeness |