| Profile 01 | High-reliability multilayer Power-control and charger-management boards | 2–32 layers Fine-line multilayer capability | Heavy copper up to 6 oz; plated through-holes; large current-carrying planes | High-Tg FR-4; halogen-free options; aluminum-backed thermal boards | IPC-6012 Class 2/3; IPC-A-600 inspection; AOI and electrical testing | Prototype to high-volume production | 5–10 working days | ★★★★★ Excellent for power modules and control systems |
| Profile 02 | Power electronics Rectifier, inverter, and PFC assemblies | 1–24 layers Mixed rigid and rigid-flex production | 2–5 oz copper; thermal vias; isolated high-voltage sections | High-Tg FR-4; metal-core PCB; thermal-management laminates | IPC-6012; IPC-A-610 assembly support; ISO 9001 quality system | Medium to high volume | 7–12 working days | ★★★★★ Strong for AC/DC conversion and power distribution |
| Profile 03 | Automotive-grade PCB Charging-interface and vehicle-communication circuits | 2–20 layers High-density interconnect options | Controlled impedance; creepage and clearance design support; copper-filled vias | Automotive-qualified laminates; high-Tg and low-loss materials | IATF 16949; ISO 9001; IPC-6012; PPAP documentation capability | High-volume automotive production | 8–15 working days | ★★★★★ Best suited to vehicle-side and safety-critical electronics |
| Profile 04 | Quick-turn engineering Prototype and pilot boards for charger development | 1–16 layers Rigid, flex, and rigid-flex options | Up to 4 oz copper; via-in-pad; press-fit and connector-ready layouts | Standard and high-Tg FR-4; polyimide flex materials | ISO 9001; IPC-A-600 inspection; automated optical inspection | Prototype and low-to-medium volume | 2–7 working days | ★★★★☆ Ideal for early-stage charger testing and validation |
| Profile 05 | Thermal-management PCB High-power semiconductor and charging modules | 1–12 layers Single- and multilayer metal-core boards | Heavy copper; insulated metal substrate; thermal-via arrays | Aluminum and copper metal-core PCB; thermally conductive dielectrics | IPC-6012; UL-recognized materials; thermal and dielectric testing | Medium-volume specialized production | 10–18 working days | ★★★★★ Highly suitable for heat-generating switching devices |
| Profile 06 | High-density interconnect Control, sensing, display, and communication boards | 2–28 layers Microvia and sequential-build capability | Fine-pitch BGA support; controlled impedance; embedded copper planes | Low-loss laminates; high-Tg FR-4; halogen-free materials | IPC-6012; IPC-2221 design guidance; automated electrical testing | Medium to high volume | 7–14 working days | ★★★★☆ Strong for compact monitoring and communications electronics |
| Profile 07 | Safety-critical power PCB Protection, isolation, metering, and supervisory circuits | 2–20 layers High-voltage layout capability | Extended creepage and clearance; slots; conformal-coating preparation | High-Tg FR-4; CTI-rated laminates; flame-retardant materials | ISO 9001; IPC Class 3 capability; UL-related design and material controls | Medium to high volume | 8–16 working days | ★★★★★ Suitable for protection and isolation functions |
| Profile 08 | Flexible interconnect Compact human-machine interfaces and sensor harnesses | 1–12 layers Flex and rigid-flex construction | Flexible copper circuits; stiffeners; selective gold contacts | Polyimide; adhesive-free flex materials; high-temperature coverlay | IPC-6013; IPC-A-600; bend-cycle and continuity testing | Prototype to medium volume | 10–20 working days | ★★★☆☆ Useful for compact auxiliary and interface assemblies |
| Profile 09 | Cost-optimized volume PCB Standardized charger-control and auxiliary power boards | 2–16 layers Standard multilayer production | 1–3 oz copper; plated slots; standard thermal-via structures | FR-4; high-Tg options; lead-free compatible finishes | ISO 9001; IPC-6012; AOI, flying-probe, and electrical testing | High-volume production | 10–20 working days | ★★★★☆ Good for standardized products where cost efficiency matters |
| Profile 10 | Integrated PCB assembly Turnkey boards for charger control and power-management systems | 2–24 layers PCB fabrication and SMT/THT assembly | Heavy-copper options; press-fit terminals; selective soldering | High-Tg FR-4; metal-core options; conformal-coating support | ISO 9001; IPC-A-610; J-STD-001; traceability and functional testing | Prototype through high volume | 7–15 working days | ★★★★★ Effective for reducing supplier count and integration time |